Nitrogen generators

The nitrogen generators N-GEN extract the available nitrogen in the ambient air from the other gases by applying the Pressure Swing Adsorption (PSA) technology. During the PSA process compressed, cleaned ambient air is led to a molecular sieve bed, which allows the nitrogen to pass through as a product gas, but adsorbs other gases. The sieve releases the adsorbed gases to the atmosphere when the outlet valve is closed and the bed pressure returns to ambient pressure. Subsequently, the bed will be purged with nitrogen before fresh compressed air will enter for a new production cycle. In order to guarantee a constant product flow, N-GEN nitrogen generators use two molecular sieve beds, which alternatively switch between the adsorption and the regeneration phase. Industrial nitrogen gas can be also produced by separation of gaseous air using membrane technology or fractional distillation of liquid air using cryogenic technology. Decision on production method depends on required purity, volume and regime of consumption.

Characteristics

operating pressure6-10 bar
operating temperature range to 50 °C
ambient air temperature rangeup to 40 °C
dew points (atmospheric)< -45 °C
capacity0,83 to 766,8 Nm3/h
purityup to 99,999 %

STANDARD EQUIPMENT

• Set of External Feed Air Filters
• Adsorber Vessels in Carbon Steel
• Long life Pneumatic and Solenoid Valves
• Internal Piping & Fittings zinc plated carbon steel
• Product Pressure Transmitters
• Nitrogen and Air flow Regulation
• Pressure Regulator
• Control System with SIEMENS PLC
• WebControl

OPTIONAL EQUIPMENT

• Oxygen Analyser
• Electronic Product Flow Meter
• Feed Air / Product Moisture Analyser
• Feed Air / Product Temperature Transmitters
• Nitrogen Sterile Filters
• Nitrogen Booster
• Nitrogen Cylinder Filling System
• Touch screen Interface
• Serial communications

Applications

• Blanketing of Chemicals
• Gas Assisted Injection Moulding (GAIM)
• Heat Treatment of Ferrous & Non-Ferrous Metals
• Inerting of Flammable Liquids
• Laser Cutting
• Prevention of Dust Explosions
• Re-flow and Wave Soldering of PCBs
• UV-Curing of Coatings
• Food processing
 

Technical data

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